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Three-dimensional integrated circuit
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Handbook Of 3d Integration
For additional information, see the Global Shipping Program terms and conditions - opens in a new window or tab No additional import charges on delivery Delivery: Estimated between Tue. An error occurred, please try again. Good : A book that has been read but is in good condition. The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities.
This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry, before going on to cover processing technology and 3D structure fabrication strategies in detail.
This is followed by fields of application and a look at the future of 3D integration. Volume IPreface.
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List of Contributors. Introduction to 3D Integration Philip Garrou. I: Through Silicon Via Fabrication. Verhoeven, Eric F. Kessels, and Richard M. SiO 2. Cale, and Ronald J. Bonding with Intermetallic Compounds Armin Klumpp.
Commercial Activity Philip Garrou. Jurgen Wolf, and Bernhard Wunderle. Paul Enquist.evtipegnewb.tk
James Jian-Qiang Lu, IEEE Fellow, 3D IC; 3D TSV Integration and Packaging
IV: Design , Performance, and thermal Management. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
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Physical Design Guideline. ComboBump Design Style. Experimental and Silicon Results. Electronic Design Automation for 3D. To achieve these targets, several key challenges are being addressed at different levels, namely at component, circuit, and module levels. Silicon photonics also offers the possibility of 3D photonic circuitry using multiple layers of optical waveguides on the same chip.
With this method, at least two silicon photonic circuits could operate together.
The different waveguide layers are placed close enough i. This integration scheme offers a new degree of freedom to designers, both to improve the performance of existing components and to develop new photonic functions. An early example of this approach pursued at Leti and STmicroelectronics within European project H COSMICC involves the introduction of a silicon nitride optical layer, the refractive index of which is much less sensitive to temperature than silicon Figure 4.
This property can be exploited to build nearly thermally insensitive wavelength multiplexers MUX , which are required for low-cost coarse wavelength division multiplexing CWDM datacenter applications where the PIC will remain uncooled. Silicon photonics already offers a very attractive scalable platform to fulfill the demands of next-generation telecom and datacom interconnects.
However, another key challenge is still the integration of laser sources. Until now, the laser source has remained separated from the rest of the chip, leading to high-cost packaging complexity and unavoidable coupling losses to the rest of the circuit. However, one promising short- and medium-term solution exists in the heterogeneous integration of III-V semiconductors with silicon through direct-bonding techniques. In this approach, unstructured InP wafers or dies are bonded with relaxed alignment tolerances, with epitaxial layers facing down, on a silicon-on-insulator wafer structured with optical waveguide circuits including passives, modulators and photodetectors.
This approach exploits the highly efficient light-emission properties of III-V semiconductor materials, as well as the compact and low-loss photonic circuits on silicon.
Related Handbook of 3D Integration: Volumes 1 and 2 - Technology and Applications of 3D Integrated Circuits
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